Gelid Solutions GP-Ultimate 15W/mK Thermal Pad 90x50x1.5mm | High Conductivity Gap Filler for GPUs and Motherboards

• ULTIMATE THERMAL CONDUCTIVITY: With a thermal conductivity of 15W / mK, the GP-ULTIMATE offers first-class performance.
• SIMPLE APPLICATION: The GP-ULTIMATE is easy to use thanks to its thermal dimensions of 90x50mm.
• NON-ELECTRICAL CONDUCTIVITY: The GP-ULTIMATE is non-electrically conductive, non-corrosive, non-hardening and non-toxic
• PERFECT SIZES: The GP-ULTIMATE sizes are perfect for PCB surfaces, VGA cards, laptops, game consoles, microcontrollers, memory ICs and other SMD components.
• AVAILABILITY OF THE THIN: The GP-ULTIMATE is available in different thicknesses of 0.5, 1.0, 1.5, 2.0 and 3.0mm

• Carefully remove the old thermal pad or paste. Clean the component surface (GPU VRAM, VRMs, chipset) and the heatsink contact area with isopropyl alcohol (90% or higher) to remove any residue and ensure a clean surface for optimal adhesion. — Prepare the Surface
• Cut the Gelid Solutions GP-Ultimate thermal pad to the required size using scissors or a craft knife. Peel off the protective film from one side and carefully place the pad onto the component surface, ensuring it covers the entire chip area without stretching. — Cut and Apply the Pad
• Remove the protective film from the other side of the thermal pad. Gently place the heatsink onto the component, ensuring proper alignment. Secure the heatsink according to your device's instructions, applying even pressure to create a firm thermal connection. — Install the Heatsink

Typical situations where Gelid Solutions GP-Ultimate 15W/mK Thermal Pad 90x50x1.5mm | High Conductivity Gap Filler for GPUs and Motherboards helps — illustrative scenarios, not customer reviews.