The UPSIREN UTP-6 Thermal Putty (20g) is engineered for high-performance thermal management in India. Unlike traditional pads, its low viscosity and excellent adhesion allow it to fill gaps completely, ensuring efficient heat transfer for GPUs, VGA, and IC processors. This fully cured material will not dry out over time, offering a reliable solution for electronic assemblies and rework scenarios.
Featuring 12.8W/mK thermal conductivity, this putty excels at dissipating heat. It is compatible with auto-dispensing equipment and stencil screen-printing, making it suitable for both manufacturing and field repair. Its ability to conform to irregular surfaces and provide consistent contact pressure helps maintain optimal operating temperatures for critical components.
This thermal putty meets RoHS standards and is halogen-free, providing safety assurance for sensitive electronic projects. Imported directly, all customs duties and GST are included in the price. Expect delivery via ExpressBox within 12-14 days.