UPSIREN UTP-6 Thermal Putty (10g) is engineered for high-performance thermal management in India. Its 12.8W/mK conductivity ensures efficient heat dissipation from GPUs, VGA, and IC processors. Unlike traditional thermal pads, this putty features low viscosity for easy dispensing and completely fills any gaps, offering superior compressibility and cost savings. It is fully cured, will not dry out, and is RoHS compliant and halogen-free, making it safe for sensitive electronic assemblies.
This thermal putty excels in rework and field repair situations. Its excellent adhesion to heat sinks and compatibility with auto-dispensing equipment or stencil screen-printing simplify application. The material's ability to fully fill gaps ensures optimal contact between components and heat sinks, enhancing cooling efficiency. Reviewers praise its high quality and performance, noting it works well to replace old thermal pads and is easy to use, even for specific laptop models.
Compared to local alternatives, the UPSIREN UTP-6 putty offers a reliable, non-drying solution for critical components. While local thermal pads might be readily available, this putty's gap-filling properties and consistent performance provide a distinct advantage for demanding applications. All customs duties and GST are included in the listed price, with delivery via ExpressBox tracked shipping.