The UPSIREN UTP-6 Thermal Putty is engineered for high-performance thermal management in electronic assemblies, including GPUs and IC processors. Unlike conventional thermal pads, this putty's low viscosity and excellent adhesion allow it to conform perfectly to uneven surfaces, filling all gaps for maximum heat transfer. It is a fully cured material that will not dry out over time, ensuring consistent performance for rework and field repair scenarios. This USA-sourced product is RoHS compliant and halogen-free, providing a safe and reliable solution for demanding applications.
Featuring a thermal conductivity of 12.8W/mK, the UTP-6 putty effectively moves heat away from critical components, helping to maintain optimal operating temperatures and prevent thermal throttling. Its good compressibility ensures reliable contact with heat sinks without causing undue pressure. This makes it a cost-effective alternative to traditional pads, especially for complex assemblies where perfect gap filling is crucial for cooling efficiency.
For Indian users, this thermal putty offers a robust solution for keeping high-performance components cool, especially in warmer climates where efficient heat dissipation is vital. It is compatible with auto-dispensing equipment and stencil screen-printing, simplifying application. All customs duties and GST are included in the listed price, with delivery via ExpressBox tracked shipping within 12-14 days.