Gelid Solutions GP-Extreme Thermal Pad 120x120x1.0mm 12W/mK | Gap Filler for PC Components

• ULTIMATE THERMAL CONDUCTIVITY: With a Thermal Conductivity of 12W/mK, the GP-EXTREME offers first-class performance.
• SIMPLE APPLICATION: Thanks to its Thermal Dimensions of 120x120mm, the GP-EXTREME is easy to use.
• SIMPLE APPLICATION: Thanks to its Thermal Dimensions of 120x120mm, the GP-EXTREME is easy to use.
• PERFECT SIZES: The GP EXTREME sizes are perfect for PCB surfaces, VGA cards, laptops, game consoles, microcontrollers, memory ICs and other SMD components.
• AVAILABILITY OF THE THIN: The GP-EXTREME is available in different thicknesses of 0.5mm, 1.0mm, 1.5mm, 2.0mm and 3.0mm

• Prepare the Surface — Carefully remove the old thermal pad or paste from the component and heatsink. Clean both surfaces thoroughly with isopropyl alcohol to ensure a residue-free finish for optimal contact.
• Cut to Size — Measure the area requiring thermal transfer. Cut the 120x120mm Gelid GP-Extreme pad to the exact dimensions needed for your component (e.g., VRAM chips, VRMs, SSD controller) using scissors or a craft knife.
• Apply the Pad — Peel off the protective film from one side of the pad. Carefully place it onto the component surface, ensuring it lies flat and covers the entire contact area without wrinkles or air bubbles.
• Install Heatsink — Remove the second protective film. Gently place the heatsink onto the component, ensuring even pressure across the pad. Reassemble your device and power it on to test thermal performance.

Typical situations where Gelid Solutions GP-Extreme Thermal Pad 120x120x1.0mm 12W/mK | Gap Filler for PC Components helps — illustrative scenarios, not customer reviews.