Gelid Solutions GP-Extreme 12W/mK Thermal Pad 120x120x0.5mm | High Conductivity Gap Filler

• ULTIMATE THERMAL CONDUCTIVITY: With a Thermal Conductivity of 12W/mK, the GP-EXTREME offers first-class performance.
• SIMPLE APPLICATION: Thanks to its Thermal Dimensions of 120x120mm, the GP-EXTREME is easy to use.
• SIMPLE APPLICATION: Thanks to its Thermal Dimensions of 120x120mm, the GP-EXTREME is easy to use.
• PERFECT SIZES: The GP EXTREME sizes are perfect for PCB surfaces, VGA cards, laptops, game consoles, microcontrollers, memory ICs and other SMD components.
• AVAILABILITY OF THE THIN: The GP-EXTREME is available in different thicknesses of 0.5mm, 1.0mm, 1.5mm, 2.0mm and 3.0mm

• Prepare the Surface — Carefully clean the component (e.g., GPU memory chips, VRMs) and the heatsink surface where the pad will make contact. Remove any old thermal material or dust using isopropyl alcohol and a lint-free cloth.
• Cut to Size — Using scissors or a craft knife, cut the 120x120x0.5mm Gelid Solutions GP-Extreme thermal pad to the exact dimensions needed for each component. Ensure the cut pieces will fit snugly between the chip and the heatsink.
• Apply the Pad — Remove any protective films from both sides of the cut thermal pad. Place the pad onto the component or heatsink, ensuring full, even contact across the entire surface area for optimal thermal transfer.
• Reassemble Component — Carefully reassemble the component, ensuring the heatsink is properly seated over the thermal pad and making firm contact with the chip. Secure the heatsink according to the device's instructions.

Typical situations where Gelid Solutions GP-Extreme 12W/mK Thermal Pad 120x120x0.5mm | High Conductivity Gap Filler helps — illustrative scenarios, not customer reviews.