Gelid Solutions GP-Ultimate Thermal Pad 15W/mK 90x50x3.0mm | High Heat Conduction Gap Filler

• ULTIMATE THERMAL CONDUCTIVITY: With a thermal conductivity of 15W / mK, the GP-ULTIMATE offers first-class performance.
• SIMPLE APPLICATION: The GP-ULTIMATE is easy to use thanks to its thermal dimensions of 90x50mm.
• NON-ELECTRICAL CONDUCTIVITY: The GP-ULTIMATE is non-electrically conductive, non-corrosive, non-hardening and non-toxic
• PERFECT SIZES: The GP-ULTIMATE sizes are perfect for PCB surfaces, VGA cards, laptops, game consoles, microcontrollers, memory ICs and other SMD components.
• AVAILABILITY OF THE THIN: The GP-ULTIMATE is available in different thicknesses of 0.5, 1.0, 1.5, 2.0 and 3.0mm

• Prepare the Surface — Carefully remove the old thermal pad or paste residue from both the component (e.g., GPU memory chips) and the heatsink using isopropyl alcohol and a lint-free cloth. Ensure surfaces are clean and dry.
• Cut and Apply the Pad — Cut the Gelid Solutions GP-Ultimate thermal pad to the required size using scissors or a craft knife. Peel off the protective film from one side and carefully place the pad onto the component or heatsink, ensuring it covers the entire contact area.
• Install the Heatsink — Gently place the heatsink onto the component with the thermal pad. Secure the heatsink according to your device's instructions, ensuring even pressure across the pad without overtightening. Remove the second protective film if present.

Typical situations where Gelid Solutions GP-Ultimate Thermal Pad 15W/mK 90x50x3.0mm | High Heat Conduction Gap Filler helps — illustrative scenarios, not customer reviews.