Gelid Solutions GP-Ultimate 15W/mK Thermal Pad 120x20x1.5mm | High Conductivity Gap Filler for PC Components

• ULTIMATE THERMAL CONDUCTIVITY: With a thermal conductivity of 15W / mK, the GP-ULTIMATE offers first-class performance.
• SIMPLE APPLICATION: The GP-ULTIMATE is easy to use thanks to its thermal dimensions of 120x20mm.
• NON-ELECTRICAL CONDUCTIVITY: The GP-ULTIMATE is non-electrically conductive, non-corrosive, non-hardening and non-toxic
• PERFECT SIZES: The GP-ULTIMATE sizes are perfect for PCB surfaces, VGA cards, laptops, game consoles, microcontrollers, memory ICs and other SMD components.
• AVAILABILITY OF THE THIN: The GP-ULTIMATE is available in different thicknesses of 0.5, 1.0, 1.5, 2.0 and 3.0mm

• Prepare the Surface — Carefully remove the old thermal pad or thermal paste residue from both the component (e.g., GPU VRAM, SSD) and the heatsink using isopropyl alcohol and a lint-free cloth. Ensure both surfaces are clean and dry.
• Cut and Apply the Pad — Cut the Gelid Solutions GP-Ultimate thermal pad to the required size using clean scissors. Peel off the protective film from one side and carefully place the pad onto the component, ensuring full contact without stretching or excessive pressure.
• Install the Heatsink — Peel off the second protective film. Align the heatsink over the component and secure it firmly. Ensure the pad is compressed evenly between the component and heatsink for optimal thermal transfer. Reassemble your device.

Typical situations where Gelid Solutions GP-Ultimate 15W/mK Thermal Pad 120x20x1.5mm | High Conductivity Gap Filler for PC Components helps — illustrative scenarios, not customer reviews.