Gelid Solutions GP-Ultimate 15W/mK Thermal Pad 120x20x1.0mm | High Conductivity for PC Components

• ULTIMATE THERMAL CONDUCTIVITY: With a thermal conductivity of 15W / mK, the GP-ULTIMATE offers first-class performance.
• SIMPLE APPLICATION: The GP-ULTIMATE is easy to use thanks to its thermal dimensions of 120x20mm.
• NON-ELECTRICAL CONDUCTIVITY: The GP-ULTIMATE is non-electrically conductive, non-corrosive, non-hardening and non-toxic
• PERFECT SIZES: The GP-ULTIMATE sizes are perfect for PCB surfaces, VGA cards, laptops, game consoles, microcontrollers, memory ICs and other SMD components.
• AVAILABILITY OF THE THIN: The GP-ULTIMATE is available in different thicknesses of 0.5, 1.0, 1.5, 2.0 and 3.0mm

• Prepare the Surface — Carefully remove the old thermal pad or any residue from the component (e.g., GPU memory chips, VRMs, SSD controller) and the heatsink contact surface. Ensure both surfaces are clean and dry.
• Cut to Size — Using scissors or a sharp blade, cut the Gelid Solutions GP-Ultimate thermal pad to the required size and shape for each component. Measure precisely to ensure full coverage without overlapping onto sensitive traces.
• Apply the Pad — Gently peel off the protective film from one side of the cut pad and carefully place it onto the component or heatsink. Press lightly to ensure good adhesion and contact. Remove the second protective film.
• Reassemble Heatsink — Carefully reattach the heatsink, ensuring it aligns correctly with the components and the thermal pad. Secure the heatsink according to your device's specifications, ensuring even pressure without overtightening.

Typical situations where Gelid Solutions GP-Ultimate 15W/mK Thermal Pad 120x20x1.0mm | High Conductivity for PC Components helps — illustrative scenarios, not customer reviews.