XPC High Performance 20W/mK Thermal Pad T20 Series | 0.5mm to 3.5mm Thickness, 100x100mm, Non-Conductive for GPU & Electronics

XPC Technologies presents the High Performance 20W/mK Thermal Pad T20 Series, a non-conductive, compressible thermal interface material ideal for electronics and computing components. Designed to fill gaps between chips and heatsinks, it ensures efficient heat transfer while preventing electrical conduction. Our testing shows a 15-20°C VRAM temperature decrease on high-end GPUs like RTX 3080 after 8-10 months of use, with 7-10°C improvements over stock pads. Suitable for graphics cards, RAM modules, VRMs, and chipsets, this pad maintains performance under continuous high-load conditions. Imported directly from the USA, it arrives in 2-8 days with duties included, ensuring reliable cooling for Indian gaming and mining setups.

Made from high-quality silicone-based materials, the pad offers excellent thermal conductivity up to 20W/mK across assorted thicknesses from 0.3mm to 3.5mm, covering a wide range of applications. Its breakdown voltage of ~9.8 KV/mm ensures electrical safety in sensitive electronics. The 100x100mm size allows easy customization for various components. Ideal for enthusiasts and professionals seeking a durable, high-performance thermal interface, this product is factory-sealed and ready for use in India, with all customs and GST duties paid.